Viktor Gonda

发表

Improved RF Devices for Future Adaptive Wireless Systems Using Two-Sided Contacting and AlN Cooling

Cong Huang, Lis K. Nanver, Koen Buisman, 2009, IEEE Journal of Solid-State Circuits.

Prediction of thermo-mechanical integrity of wafer backend processes

Willem D. van Driel, G. Q. Zhang, Jaap M. J. den Toonder, 2004, Microelectron. Reliab..

Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques

G. Q. Zhang, Kaspar M. B. Jansen, Jaap M. J. den Toonder, 2007, Microelectron. Reliab..

Sensitivity of the structural behavior of SAC305 interconnects on the variations of creep parameters

Viktor Gonda, Ramiro Sebastian Vargas Cruz, 2021, 2021 IEEE 15th International Symposium on Applied Computational Intelligence and Informatics (SACI).