Jenwei Ko

Two 10Gb/s/pin Low-Power Interconnect Methods for 3D ICs

Mau-Chung Frank Chang, Qun Gu, Zhiwei Xu, 2007, 2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers.

A self-synchronized RF-interconnect for 3-dimensional integrated circuits

Zhiwei Xu, Qun Jane Gu, M. Frank Chang, 2004, 2004 IEEE International Symposium on Circuits and Systems (IEEE Cat. No.04CH37512).

An RF/baseband FDMA-interconnect transceiver for reconfigurable multiple access chip-to-chip communication

Zhiwei Xu, Jongsun Kim, Qun Gu, 2005, ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005..

A 2×2 MIMO 802.11 b/g/n WLAN SOC in 55nm CMOS for AP/Router application

Pi-An Wu, Bart Wu, Chih-Lung Chen, 2013, 2013 IEEE Asian Solid-State Circuits Conference (A-SSCC).

2.5 A high-efficiency multiband Class-F power amplifier in 0.153µm bulk CMOS for WCDMA/LTE applications

Changhua Cao, Jing Li, Jenwei Ko, 2017, 2017 IEEE International Solid-State Circuits Conference (ISSCC).

Three-dimensional circuit integration based on self-synchronized RF-interconnect using capacitive coupling

Zhiwei Xu, Jongsun Kim, Qun Gu, 2004, Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004..