Young-Su Heo

Reusable HEVC Design in 3D‐HEVC

Gwang Hoon Park, Gun Bang, Heo Young Su, 2016 .

Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI

Hoyoung Kang, Hyun-Chul Sagong, Junekyun Park, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).