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Double-patterning interactions with wafer processing, optical proximity correction, and physical design flows

Vincent Wiaux, Staf Verhaegen, Kevin Lucas, 2009 .

Numerical Analysis of Packaging-Induced Failures in Cu/Low-k Interconnects

V. Moroz, Xiaopeng Xu, A. Karmarkar, 2008 .

Impact of Fabrication Process, Layout Variation and Packaging Process on Cu/Low-k Interconnect Reliability

D. Pramanik, A. Karmarkar, Xi-Wei Lin, 2007 .

Stress-aware design methodology

Dipu Pramanik, Victor Moroz, Xi-Wei Lin, 2006, 7th International Symposium on Quality Electronic Design (ISQED'06).