F. Ren

Electromigration effect on intermetallic growth and Young’s modulus in SAC solder joint

K. Tu, J. Pang, Luhua Xu, 2006 .

Electromigration effect on strain and mechanical property change in lead-free solder joints

K. Tu, J. Pang, Luhua Xu, 2006, 2006 8th Electronics Packaging Technology Conference.

Effect of electromigration on mechanical shear behavior of flip chip solder joints

K. Tu, K. Paik, J. Nah, 2006, Journal of Materials Research.

Electromigration in Pb-free flip chip solder joints on flexible substrates

Jae-Woong Nah, King-Ning Tu, K. Tu, 2006 .

Effect of electromigration on mechanical behavior of solder joints

K. Tu, J. Pang, B. Xiong, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

Electromigration induced ductile-to-brittle transition in lead-free solder joints

John H. L. Pang, Jae-Woong Nah, King-Ning Tu, 2006 .

Study of the initial stage of electroless Ni deposition on Si (100) substrates in aqueous alkaline solution

M. Goorsky, K. Tu, Xi Zhang, 2006 .

In-situ study of the effect of electromigration on strain evolution and mechanical property change in lead-free solder joints

K. Tu, J. Pang, Luhua Xu, 2006, 56th Electronic Components and Technology Conference 2006.

Young's modulus as a function of composition for an n-type lead–antimony–silver–telluride (LAST) thermoelectric material

H. Schock, F. Ren, E. Timm, 2007 .