M. Shah

CuBOL (Cu-column on BOL) technology: A low cost flip chip solution scalable to high I/O density, fine bump pitch and advanced Si-nodes

S. Movva, S. Bezuk, O. Bchir, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Mechanical properties of Sn-In and Pb-In solders at low temperature

Yanqing Liu, W. K. Jones, M. Shah, 1997, Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces.