M. Joshi

CuBOL (Cu-column on BOL) technology: A low cost flip chip solution scalable to high I/O density, fine bump pitch and advanced Si-nodes

S. Movva, S. Bezuk, O. Bchir, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Low cost flip chip (LCFC): An innovative approach for breakthrough reduction in flip chip package cost

M. Joshi, H T Lee, P. Kim, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

fcCuBE technology: A pathway to advanced Si-node and fine pitch flip chip

Young Chul Kim, M. Joshi, H. Eslampour, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.