Huai-Hui Ren

SEM in situ study on high cyclic fatigue of SnPb-solder joint in the electronic packaging

Hai-Yan Zhao, Ryosuke Murai, Xi-Shu Wang, 2011, Microelectron. Reliab..

Simulation study on thermo-fatigue failure behavior of solder joints in package-on-package structure

Su Jia, Xi-Shu Wang, Hui-Hua Yang, 2017, Microelectron. Reliab..

Fracture analysis on die attach adhesives for stacked packages based on in-situ testing and cohesive zone model

Su Jia, Xi-Shu Wang, Huai-Hui Ren, 2013, Microelectron. Reliab..

Effects of solder balls and arrays on the failure behavior in Package-on-Package structure

Pan Pan, Su Jia, Xi-Shu Wang, 2014, Microelectron. Reliab..

An organic junction between the vein and membrane of the dragonfly wing

Huai-Hui Ren, Xu-Dong Li, Xu-Dong Li, 2011 .

Effects of dragonfly wing structure on the dynamic performances

Huai-Hui Ren, Xu-Dong Li, Xu-Dong Li, 2013 .