Glenn A. Rinne

Design and process impact on thin-film interconnection performance

Lih-Tyng Hwang, Glenn A. Rinne, Gretchen M. Adema, 1991 .

Three dimensional high density MCM package assembly and analysis

Paul D. Franzon, A. Glaser, Glenn A. Rinne, 1999 .

Chip scale packaging and redistribution

Glenn A. Rinne, J. D. Mis, P. A. Magill, 1998, Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153).

An extended time-domain network analysis measurement technique

Lih-Tyng Hwang, Glenn A. Rinne, Iwona Turlik, 1995 .

Flip chip overview

Glenn A. Rinne, J. D. Mis, P. A. Magill, 1996, Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893).

A low cost, high performance three-dimensional memory module technology

Glenn A. Rinne, M. Nakkar, C. K. Williams, 1997, Proceedings. International Workshop on Memory Technology, Design and Testing (Cat. NO.97TB100159).

Issues in accelerated electromigration of solder bumps

Glenn A. Rinne, 2003, Microelectron. Reliab..

Electromigration in SnPb and Pb-free solder bumps

Glenn A. Rinne, 2004, ECTC 2004.

Flip Chip Technology: A Method for Providing Known Good Die with High Density Interconnections

Glenn A. Rinne, Gretchen M. Adema, Iwona Turlik, 1994, Proceedings of the International Conference on Multichip Modules.

Solder bumping methods for flip chip packaging

Glenn A. Rinne, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

Passivation schemes for copper/polymer thin film interconnections used in multichip modules

Glenn A. Rinne, Iwona Turlik, L.-T. Hwang, 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

Analysis of a multilayered-metal thin-film transmission line

Lih-Tyng Hwang, Glenn A. Rinne, Iwona Turlik, 1995 .