Frederic Lazzarino

发表

FEOL dry etch process challenges of ultimate FinFET scaling and next generation device architectures beyond N3

Zheng Tao, Boon Teik Chan, Liping Zhang, 2020, Advanced Lithography.

Demonstration of an N7 integrated fab process for metal oxide EUV photoresist

Geert Vandenberghe, Peter De Schepper, Danilo De Simone, 2016, SPIE Advanced Lithography.

Impact of sequential infiltration synthesis (SIS) on roughness and stochastic nano-failures for EUVL patterning

Geert Vandenberghe, Gijsbert Rispens, Guido Schiffelers, 2019, Advanced Lithography.

Localized power spectral density analysis on atomic force microscopy images for advanced patterning applications

Philippe Leray, Anne-Laure Charley, Frederic Lazzarino, 2019, Advanced Lithography.

Comparing positive and negative tone development process for printing the metal and contact layers of the 32- and 22-nm nodes

Geert Vandenberghe, Shinji Tarutani, Joost Bekaert, 2010 .

Staggered pillar patterning using 0.33NA EUV lithography

Lieve Van Look, Geert Vandenberghe, Jeroen Van de Kerkhove, 2019, Advanced Lithography.

Exploration of a low-temperature PEALD technology to trim and smooth 193i photoresist

Gian Francesco Lorusso, Vito Rutigliani, Vassilios Constantoudis, 2017, Advanced Lithography.

Experimental verification of source-mask optimization and freeform illumination for 22-nm node static random access memory cells

Geert Vandenberghe, Jens Timo Neumann, Mircea Dusa, 2011 .

Self-aligned block and fully self-aligned via for iN5 metal 2 self-aligned quadruple patterning

Sandip Halder, Joern-Holger Franke, Joseph Ervin, 2018, Advanced Lithography.

The chemistry screening for ultra low-k dielectrics plasma etching

Frederic Lazzarino, Mikhail R. Baklanov, Alexey Zotovich, 2014, Other Conferences.

Ultimate contact hole resolution using immersion lithography with line/space imaging

Mireille Maenhoudt, Joost Bekaert, Timothy Wu, 2009, Advanced Lithography.

Patterning with metal-oxide EUV photoresist: patterning capability, resist smoothing, trimming, and selective stripping

Peter De Schepper, Danilo De Simone, Ming Mao, 2017, Advanced Lithography.

Setting up a proper power spectral density and autocorrelation analysis for material and process characterization

Gian Francesco Lorusso, Vito Rutigliani, Evangelos Gogolides, 2018 .

Setting up a proper power spectral density (PSD) and autocorrelation analysis for material and process characterization

Gian Francesco Lorusso, Gijsbert Rispens, Vito Rutigliani, 2018, Advanced Lithography.

Linewidth and roughness measurement of SAOP by using FIB and Planer-TEM as reference metrology

Satoru Takahashi, Kiyoshi Takamasu, Masami Ikota, 2019, Advanced Lithography.

Patterning development in spin-on hard mask systems for 30nm half-pitch EUV technology

Christopher J. Wilson, Ivan Pollentier, Monique Ercken, 2012, Other Conferences.

SAQP and EUV block patterning of BEOL metal layers on IMEC's iN7 platform

Ming Mao, Eric Hendrickx, Friso Wittebrood, 2017, Advanced Lithography.

Exploration of post-lithography smoothening methods applied to 16nm half-pitch EUV lines and spaces (Conference Presentation)

Ming Mao, Nadia Vandenbroeck, Daniele Piumi, 2018 .

Simulation and measurement of the capacitance benefit of air gap interconnects for advanced technology nodes

Christopher J. Wilson, V. Truffert, Jürgen Bömmels, 2014 .

Fabrication of a micro-lens array for Reflective Electron Beam Lithography

L. Haspeslagh, Harold Dekkers, Luca Grella, 2011 .

Modeling the topography of uneven substrates post spin-coating

Werner Gillijns, Frederic Lazzarino, Xiaoyu Piao, 2018 .

Metal Containing Resist Readiness for HVM EUV Lithography

Geert Vandenberghe, Ming Mao, Frederic Lazzarino, 2016 .

Subtractive Etch of Ruthenium for Sub-5nm Interconnect

Christopher J. Wilson, Christoph Adelmann, Monique Ercken, 2018, 2018 IEEE International Interconnect Technology Conference (IITC).