Sunjae Jang

Note: Evaluation of slurry particle size analyzers for chemical mechanical planarization process.

Taesung Kim, A. Kulkarni, Hongyi Qin, 2016, The Review of scientific instruments.

The Synthesis of Novel Polystyrene-SiO2 Composite Abrasive for CMP Slurry

Taesung Kim, Hongyi Qin, Yang Xu, 2013 .

Effect of secondary inhibitors on material removal rate and nano-roughness of Cu chemical mechanical planarization

Taesung Kim, D. Amalnerkar, Hongyi Qin, 2016 .