Akiteru Ko

发表

Line roughness improvements on self-aligned quadruple patterning by wafer stress engineering

Akiteru Ko, Kazuya Okubo, Eric Liu, 2018, Advanced Lithography.

Novel patterning schemes and technologies for the sub 5nm era

Akiteru Ko, Peter Biolsi, Jeffrey Smith, 2018, 2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA).

Multi-color approach on self-aligned multiple patterning for single line cut application

Akiteru Ko, Eric Liu, Peter Biolsi, 2018, Advanced Lithography.

Strategies for aggressive scaling of EUV multi-patterning to sub-20 nm features

Joe Lee, Akiteru Ko, Cody Murray, 2020, Advanced Lithography.

Resist process applications to improve EUV patterning

Akiteru Ko, Dominic Ashworth, Takashi Saito, 2013, Advanced Lithography.

Line width roughness control for EUV patterning

Akiteru Ko, Dominic Ashworth, Shinichiro Kawakami, 2012, Advanced Lithography.

Self-aligned blocking integration demonstration for critical sub-30-nm pitch Mx level patterning with EUV self-aligned double patterning

Yongan Xu, Akiteru Ko, Nelson Felix, 2018 .

DSA patterning options for logics and memory applications

Akiteru Ko, John Arnold, Nelson Felix, 2017, Advanced Lithography.

Self-aligned quadruple patterning using spacer on spacer integration optimization for N5

Angélique Raley, Akiteru Ko, Peter Biolsi, 2017, Advanced Lithography.

Coater/developer based techniques to improve high-resolution EUV patterning defectivity

Yongan Xu, Akiteru Ko, Nelson Felix, 2017, Photomask Technology.

Roughness and uniformity improvements on self-aligned quadruple patterning technique for 10nm node and beyond by wafer stress engineering

Akiteru Ko, Eric Liu, Peter Biolsi, 2017, Advanced Lithography.

EUV patterning using CAR or MOX photoresist at low dose exposure for sub 36nm pitch

Akiteru Ko, Peter Biolsi, Danilo De Simone, 2018, Advanced Lithography.

Fin formation using graphoepitaxy DSA for FinFET device fabrication

Akiteru Ko, Nelson Felix, Nihar Mohanty, 2015, Advanced Lithography.

Self-aligned blocking integration demonstration for critical sub-40nm pitch Mx level patterning

Jeffrey T. Smith, Xinghua Sun, Richard A. Farrell, 2017, Advanced Lithography.

LER improvement for sub-32nm pitch self-aligned quadruple patterning (SAQP) at back end of line (BEOL)

Akiteru Ko, Peter Biolsi, Lei Sun, 2016, SPIE Advanced Lithography.

Dual frequency mid-gap capacitively coupled plasma (m-CCP) for conventional and DSA patterning at 10nm node and beyond

Akiteru Ko, Ji Xu, Nihar Mohanty, 2014, Advanced Lithography.

Dry-plasma-free chemical etch technique for variability reduction in multi-patterning (Conference Presentation)

Richard A. Farrell, Akiteru Ko, Peter Biolsi, 2017, Advanced Lithography.

DSA patterning options for FinFET formation at 7nm node

Akiteru Ko, Nelson Felix, Mark Somervell, 2016, SPIE Advanced Lithography.

Towards electrical testable SOI devices using Directed Self-Assembly for fin formation

Akiteru Ko, Hong He, Nihar Mohanty, 2014, Advanced Lithography.

Benchmarking of EUV lithography line/space patterning versus immersion lithography multipatterning schemes at equivalent pitch

Akiteru Ko, Eric Liu, Angélique Raley, 2018, Photomask Technology.

Self-aligned quadruple patterning integration using spacer on spacer pitch splitting at the resist level for sub-32nm pitch applications

Angélique Raley, Akiteru Ko, Peter Biolsi, 2016, SPIE Advanced Lithography.

EPE improvement thru self-alignment via multi-color material integration

Jeffrey T. Smith, Akiteru Ko, Carlos Fonseca, 2017, Advanced Lithography.

Fabrication of 28nm pitch Si fins with DSA lithography

Akiteru Ko, Ji Xu, Nihar Mohanty, 2013, Advanced Lithography.

Optimization of low-diffusion EUV resist for linewidth roughness and pattern collapse on various substrates

Akiteru Ko, James W. Thackeray, Warren Montgomery, 2012, Other Conferences.

Advanced multiple patterning technologies for high density hexagonal hole arrays

Akiteru Ko, Peter Biolsi, Sophie Thibaut, 2021, Advanced Lithography.