Patrick Verdonck

发表

The effects of scaling on Back End of Line Processing

Christopher J. Wilson, Patrick Verdonck, Liang Gong Wen, 2014, 2014 29th Symposium on Microelectronics Technology and Devices (SBMicro).

Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers

Peter De Bisschop, Christopher J. Wilson, Ming Mao, 2018, Advanced Lithography.

Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora\textregistered LK HM

David De Roest, Nancy Heylen, Herbert Struyf, 2010 .

Effect of porosity on the mechanical and fracture properties of advanced PECVD Ultralow-k SiCOH films

Mario Gonzalez, Kris Vanstreels, Patrick Verdonck, 2012 .

Simulation and measurement of the capacitance benefit of air gap interconnects for advanced technology nodes

Christopher J. Wilson, V. Truffert, Jürgen Bömmels, 2014 .

Impact of carbon-doping on time dependent dielectric breakdown of SiO2-based films

Cor Claeys, Y Yohan Barbarin, Larry Zhao, 2015 .

Correlation between stress-induced leakage current and dielectric degradation in ultra- porous SiOCH low-k materials

I. De Wolf, Ivan Ciofi, K. Croes, 2015 .

Plasma-Enhanced Atomic Layer Deposition of Two-Dimensional WS2 from WF6, H2 Plasma, and H2S

Iuliana Radu, Wilfried Vandervorst, Stefan De Gendt, 2017 .

Patrick Verdonck, P. Verdonck, 2022 .

Reactive ion etching and plasma etching of tungsten

Jacobus W. Swart, Patrick Verdonck, G. Brasseur, 1993 .

Effect of bake/cure temperature of an advanced organic ultra low-k material on the interface adhesion strength to metal barriers

Marianna Pantouvaki, Kris Vanstreels, Patrick Verdonck, 2011 .

Intrinsic effect of porosity on mechanical and fracture properties of nanoporous ultralow-k dielectrics

Kris Vanstreels, Patrick Verdonck, Mikhail R. Baklanov, 2012 .

Effect of pore structure of nanometer scale porous films on the measured elastic modulus.

Mario Gonzalez, Kris Vanstreels, Patrick Verdonck, 2013, Langmuir : the ACS journal of surfaces and colloids.