Q. Shi

Spark Plasma Sintering of α/β Si3N4 Ceramics with MgO-Al2O3 and MgO-Y2O3 as Sintering Additives

Yu Bai, J. H. Wu, F. Yu, 2016, Journal of Materials Engineering and Performance.

Effect of reflow temperature and time on the interfacial reaction of Sn-xCu/(001) Cu

Xu Zhou, Hong Wei, Q. Shi, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Experimental characterization of novel SiC foam corrugated structured packing with varied pore size and corrugation angle

H. Li, A. Pavlenko, X. Gao, 2017, Journal of Engineering Thermophysics.

Fabrication of full intermetallic compound interconnects with single crystal (111) Cu under bump metallization

Q. Shi, Zhi-Jie Zhang, Hong Wei, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Effect of Different Ni Contents on Thermal Stability of Cu(Ni) Alloy Film

Xu Li, Yi Zhu, Lei Wang, 2020, Journal of Electronic Materials.