N. Weyrich

发表

Joining of metals and ceramics using Au-(Ge, Si)-based solder alloys

N. Weyrich, 2015 .

Low temperature TLP bonding of Al2O3–ceramics using eutectic Au–(Ge, Si) alloys

C. Leinenbach, N. Weyrich, 2013, Journal of Materials Science.

Al2O3–Al2O3 and Al2O3–Ti Solder Joints—Influence of Ceramic Metallization and Thermal Pretreatment on Joint Properties

C. Leinenbach, G. Gamez, H. Elsener, 2012 .

Characterization of the isothermal solidification process in the Ni/Au–Ge layer system

C. Leinenbach, N. Weyrich, 2015, Journal of Materials Science.

Joining of Cu, Ni, and Ti Using Au-Ge-Based High-Temperature Solder Alloys

C. Leinenbach, L. Duarte, S. Jin, 2014, Journal of Materials Engineering and Performance.