K. Tai

Effect of preamorphization implantation on C54–TiSi2 formation in salicided narrow lines

H. Onoda, M. Okihara, M. Kageyama, 1999 .

Transmission Electron Microscopic Studies of TiSi2 Microstructures and the C49-C54 Phase Transformation in Narrow Lines

H. Onoda, M. Okihara, N. Hirashita, 1999 .

Microstructural study on the C49-to-C54 phase transformation in TiSi2 formed from preamorphization implantation

H. Onoda, M. Okihara, N. Hirashita, 1999 .

Newly developed electro-chemical polishing process of copper as replacement of CMP suitable for damascene copper inlaid in fragile low-k dielectrics

S. Takahashi, T. Nogami, S. Sato, 2001, International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224).

Fragile porous low-k/copper integration by using electro-chemical polishing

S. Takahashi, T. Nogami, N. Komai, 2002, 2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303).

Electron diffraction studies of Ag photodoping in GexSe1−x glass films

K. Tai, Chih Chen, 1980 .

Whisker Growth induced by Ag photodoping in glassy GexSe1−x films

K. Tai, Chih Chen, 1980 .

Study on mechanism of crystallization in HfO2 films on Si substrates by in-depth profile analysis using photoemission spectroscopy

Yun Sun, Shiyu Sun, D. Lee, 2009 .