Youngseok Kim

Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current

K. Suganuma, T. Sugahara, S. Nagao, 2014, Journal of Electronic Materials.

Enhanced reliability of Sn–Ag–Bi–In joint under electric current stress by adding Co/Ni elements

K. Suganuma, T. Sugahara, S. Nagao, 2014, Journal of Materials Science: Materials in Electronics.

Effects of additional Ni and Co on microstructural evolution in Sn-Ag-Bi-In solder under current stressing

K. Suganuma, T. Sugahara, S. Nagao, 2012, 2012 2nd IEEE CPMT Symposium Japan.

Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys

Katsuaki Suganuma, Keun-Soo Kim, K. Suganuma, 2003 .

Effect of electromigration on mechanical shock behavior in solder joints of surface mounted chip components

K. Suganuma, T. Sugahara, S. Nagao, 2014 .

Microstructure Changes in Sn-Zn/Cu Joints During Heat-Exposure

K. Suganuma, Keun-Soo Kim, Hideo Nakajima, 2002 .