S. Haque

An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

D. Borojevic, Ray-Lee Lin, Douglas J. Nelson, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Three-dimensional flip-chip on flex packaging for power electronics applications

Guo-Quan Lu, Xingsheng Liu, S. Haque, 2001 .

Design of Low-Noise Output Amplifiers for P-channel Charge-Coupled Devices Fabricated on High-Resistivity Silicon - eScholarship

S. Haque, 2013 .

An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

Ray-Lee Lin, Guo-Quan Lu, Fred C. Lee, 1999 .

Packaging for thermal management of power electronics building blocks using metal posts interconnected parallel plate structure

Fred C. Lee, D. Borojevic, Guo-Quan Lu, 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).

Thermal management of high-power electronics modules packaged with interconnected parallel plates

D. Borojevic, Guo-Quan Lu, Fred C. Lee, 1998, Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195).

Packaging of integrated power electronics modules using flip-chip technology

Guo-Quan Lu, Xingsheng Liu, S. Haque, 2000, APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058).

Development of a stacked-plate technique for 3-D packaging of power electronics modules

Fred C. Lee, D. Borojevic, S. Haque, 1998, IWIPP Proceedings. IEEE International Workshop on Integrated Power Packaging (Cat. No.98EX203).

Characterization of interfacial thermal resistance by acoustic micrography imaging

S. Haque, Guo-Quan Lu, J. Sigmund, 2000 .

Electric and thermal transient effects in high power optical devices

A. Poppe, G. Farkas, S. Haque, 2004, Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545).

Thermal management of power electronics modules via acoustic micrography imaging

S. Haque, Guo-Quan Lu, J. Goings, 2000, APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058).