Xiaohui Wang

Rheology and Thermal Conductivity of Diamond Powder-Filled Liquid Epoxy Encapsulants for Electronic Packaging

K. Sheng, Yongxi Zhang, J.H. Zhao, 2009, IEEE Transactions on Components and Packaging Technologies.

Fabrication and Characterization of High-Current-Gain 4H-SiC Bipolar Junction Transistors

P. Alexandrov, L. Fursin, J.H. Zhao, 2008, IEEE Transactions on Electron Devices.