T. Maeda

Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs

Tadanori Shimoto, Koji Matsui, Takehiko Maeda, 2005, Microelectron. Reliab..

Development of chip scale packages (CSP) for center pad devices

T. Saitoh, M. Amagai, T. Maeda, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.