J. Moon

Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability

J. H. Won, H. Kim, Y.J. Park, 2001, Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).

Investigation of recrystallization and grain growth of copper and gold bonding wires

A. Rollett, K. Oh, J. Cho, 2006 .

Characterization of Cold Drawn Gold bonding Wire with EBSD

A. Rollett, K. Oh, J. Cho, 2002 .

Effect of aluminium additions on wettability and intermetallic compound (IMC) growth of lead free Sn (2 wt. % Ag, 5 wt. % Bi) soldered joints

Ashutosh Sharma, Seyoung Kee, Young Woo Lee, 2014, Electronic Materials Letters.

Predicting the Drop Performance of Solder Joints by Evaluating the Elastic Strain Energy from High-Speed Ball Pull Tests

Yunsung Kim, Heeman Choe, Jaehong Lee, 2009 .

Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding

Michael Mayer, Jeong-Tak Moon, A. Pequegnat, 2009 .

Recrystallization and grain growth of cold-drawn gold bonding wire

Kyu Hwan Oh, Anthony D. Rollett, J. T. Moon, 2003 .

Recrystallization and Grain Growth of Gold bonding Wire

A. Rollett, K. Oh, J. Cho, 2002 .