Zhiyuan Zhang

Effects of solder thickness on interface behavior and nanoindentation characteristics in Cu/Sn/Cu microbumps

Shanglei Yang, Pei-lei Zhang, Jieshi Chen, 2022, Welding in the World.

Forming mechanism and growth of Kirkendall voids of Sn/Cu joints for electronic packaging: A recent review

Hao Lu, Xiaowu Hu, Jieshi Chen, 2022, Journal of Advanced Joining Processes.

Effect of Structural Design on the Pore Structure, Water Resistance, and Mechanical Properties of Engineered Wood/Bamboo Laminated Composites

Pu Zhao, Luming Li, Fei Rao, 2022, Polymers.

Effect of refractory elements M (=Re, W, Mo or Ta) on the diffusion properties of boron in nickel-based single crystal superalloys

Haotian Lu, Jie-ming Chen, Zhiyuan Zhang, 2023, Vacuum.

Structural response and energy absorption assessment of corrugated wall mechanical metamaterials under static and dynamic compressive loading

Pengwan Chen, Gaojian Lin, Weifu Sun, 2022, International Journal of Impact Engineering.