S. Horikami

Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers

N. Kuwano, M. Linus, S. Horikami, 2015 .

Effects of Post-Plating Reflow on Changes in Crystal Grain Size of Sn-2 mass%Bi Alloy Plating with Thermal Cycling Treatment

H. Sosiati, N. Kuwano, S. Horikami, 2010 .