J. Richards

Interface and layer periodicity effects on the thermal conductivity of copper-based nanomultilayers with tungsten, tantalum, and tantalum nitride diffusion barriers

F. La Mattina, S. King, P. Hopkins, 2020, Journal of Applied Physics.

Controlled fracture of Cu/ultralow-k interconnects

Jimmy Liu, M. Kobrinsky, M. Kuhn, 2013 .

Interfacial Defect Vibrations Enhance Thermal Transport in Amorphous Multilayers with Ultrahigh Thermal Boundary Conductance

W. Lanford, A. Henry, F. DeAngelis, 2018, Advanced materials.

Gate length scaling beyond Si: Mono-layer 2D Channel FETs Robust to Short Channel Effects

M. Metz, U. Avci, A. Penumatcha, 2022, 2022 International Electron Devices Meeting (IEDM).