C. W. Chang

Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples

C. Kao, C. W. Chang, C. E. Ho, 2006 .

Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu

C. Kao, C. W. Chang, C. E. Ho, 2006 .

Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints

Y. L. Lin, C. Kao, C. Lee, 2006 .

Kinetics of AuSn4 migration in lead-free solders

C. Kao, C. W. Chang, C. E. Ho, 2006 .

Massive Spalling of Intermetallic Compound in Lead-Free Solder Joints

C. Kao, Cheng-En Ho, Su-Chun Yang, 2006 .

Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints

C. Kao, W. Luo, C. W. Chang, 2004 .

Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element

C. Kao, C. W. Chang, C. E. Ho, 2007 .

Controlling the microstructure from the gold-tin reaction

C. Kao, J. Tsai, C. W. Chang, 2005 .

Effect of nano-TiO2 addition on wettability and interfacial reactions of Sn0.7Cu composite solder/Cu solder joints

C. W. Chang, L. Tsao, B. C. Wang, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Patterns of Solution-Processed Graphene Oxide Produced by a Transfer Printing Method

M. Hon, I. Leu, C. W. Chang, 2012 .

Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates

Y. L. Lin, C. Kao, J. Tsai, 2006 .