Kohei Mitsui

Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder

M. Yamamoto, I. Shohji, Tatsuya Kobayashi, 2021, Materials.

Effects of Ni Addition to Sn–5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties

I. Shohji, Tatsuya Kobayashi, Kohei Mitsui, 2019, MATERIALS TRANSACTIONS.

Comparison of Sn-5Sb and Sn-10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size Specimens

I. Shohji, Tatsuya Kobayashi, Kyosuke Kobayashi, 2018, Advances in Materials Science and Engineering.

Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens

I. Shohji, Tatsuya Kobayashi, Kyosuke Kobayashi, 2018 .

Effect of Additive Element on Fatigue Properties of Sn-Sb-Ag High Temperature Lead-Free Solder

K. Kawai, M. Yamamoto, I. Shohji, 2023, Journal of The Japan Institute of Electronics Packaging.