B. Stark

Fluxless wafer-level Cu-Sn bonding for micro- and nanosystems packaging

Nils Hoivik, Kaiying Wang, Adriana Lapadatu, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Cu-Sn Wafer Level Bonding for Vacuum Encapsulation of Microbolometer Focal Plane Arrays

Nils Hoivik, Adriana Lapadatu, Gjermund Kittilsland, 2010 .