Hee-Ra Roh

Contact resistance and shear strength of the solder joints formed using Cu bumps capped with Sn or Ag/Sn layer

Young-Ho Kim, Seunghyun Lee, Young-Ho Kim, 2005 .

A new solder wetting layer for Pb-free solders

Young-Ho Kim, Jin Soo Lee, Young-Min Kim, 2009 .

Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates

Young-Ho Kim, Sungtae Kim, Sungtae Kim, 2010 .

A new Cu-Zn solder wetting layer for improved impact reliability

Young-Ho Kim, Young Min Kim, C. Oh, 2009, 2009 59th Electronic Components and Technology Conference.

Formation and growth of intermetallic compounds at the interface between Pb-free solder and Cu-Zn alloy UBM

Young-Ho Kim, C. Oh, Hee-Ra Roh, 2007 .

Intermetallic compound formation and solder joint reliability of Sn-Ag-Cu solder ball on Cu-Zn substrate

Young-Ho Kim, Hee-Ra Roh, 2007, 2007 International Conference on Electronic Materials and Packaging.