Branndon R. Chen

A methodology for predicting processing induced thermal residual stress in thermoplastic composite at the microscale

J. Gillespie, J. Deitzel, Nithin K. Parambil, 2022, Composites Part B: Engineering.

Cantilever testing of sintered-silver interconnects

Brian A. Oistad, M. C. Modugno, J. Sharp, 2017, Journal of Materials Science: Materials in Electronics.

Failure stress comparison of different pairings of Ag-plating and reflow-oven-processed pressureless-sintered-Ag interconnects

Brian A. Oistad, A. Wereszczak, S. Waters, 2018, Journal of Materials Science: Materials in Electronics.

Threshold angle and valid fracture of the sectored flexural specimen

Brian A. Oistad, A. Wereszczak, O. Jadaan, 2018, International Journal of Applied Ceramic Technology.

Process-Induced Residual Stress in a Single Carbon Fiber Semicrystalline Polypropylene Thin Film

Nithin K. Parambil, Branndon R. Chen, John W. Gillespie, 2023, Composites Part A: Applied Science and Manufacturing.