Young-Doo Jeon

发表

Stresses in electroless Ni-P films for electronic packaging applications

Young-Doo Jeon, Kyung-Wook Paik, K. Paik, 2002 .

Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy

H. Reichl, K. Paik, Young-Doo Jeon, 2005 .

Interfacial reactions and bump reliability of various Pb-free solder bumps on electroless Ni-P UBMs

K. Paik, M. Cho, Young-Doo Jeon, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy

H. Reichl, K. Paik, A. Ostmann, 2003 .

Comparison of interfacial reactions and reliabilifies of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMs

H. Reichl, K. Paik, Young-Doo Jeon, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0Ag-0.5Cu alloy

H. Reichl, Sabine Nieland, Young-Doo Jeon, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages

Kyung-Wook Paik, Soon-Bok Lee, Se Young Yang, 2006, Microelectron. Reliab..

Reduced thermal strain in flip chip assembly on organic substrate using low CTE anisotropic conductive film

Young-Doo Jeon, Kyung-Wook Paik, Myung Jin Yim, 2000 .

Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

Joungho Kim, Seungyoung Ahn, Woonghwan Ryu, 1999 .

Flip chip assembly on organic boards using anisotropic conductive adhesives (ACAs) and nickel/gold bumps

K. Paik, M. Yim, Young-Doo Jeon, 1999, Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).

Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless nickel UBM-solder interface and their effects on flip chip solder joint reliability

Young-Doo Jeon, Kyung-Wook Paik, K. Paik, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Assembly yield enhancement of electroless Ni-P UBM/Pb-free solder joints

K. Paik, Yong-min Kwon, Young-Doo Jeon, 2005, Electronic Packaging Technology Conference.