V. Nguyen

The effects of reactive precleaning (RPC+) on the formation of titanium silicide by PECVD TiCl/sub 4/-Ti deposition, and its thermal stability

Feng Wu, A. Gelatos, J. Kopp, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Step and Repeat UV nanoimprint lithography tools and processes

Ecron Thompson, Mike Watts, Ian McMackin, 2004, SPIE Advanced Lithography.