You-Wen Yau

Requirement of effective fabless/foundry interactions for achieving robust product reliability

Sriram Kalpat, Homyar C. Mogul, Christine Hau-Riege, 2010 .

BSIM4-based lateral diode model for RF ESD applications

You-Wen Yau, Ming-Ta Yang, Tony Chang, 2010, 2010 IEEE 11th Annual Wireless and Microwave Technology Conference (WAMICON).

The electromigration behavior of copper pillars for different current directions and pillar shapes

You-Wen Yau, Rajneesh Kumar, Lily Zhao, 2015, 2015 IEEE International Reliability Physics Symposium.

An Innovative Understanding of Metal–Insulator–Metal (MIM)-Capacitor Degradation Under Constant-Current Stress

You-Wen Yau, Horng-Chih Lin, A.S. Oates, 2007, IEEE Transactions on Device and Materials Reliability.

BSIM4-based lateral diode model for LNA co-designed with ESD protection circuit

Yang Du, You-Wen Yau, Ming-Ta Yang, 2010, 2010 11th International Symposium on Quality Electronic Design (ISQED).

Electromigration of multi-solder ball test structures

You-Wen Yau, Xiaonan Zhang, Huilin Xu, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

Electromigration studies of lead-free solder balls used for wafer-level packaging

Jong-Kai Lin, Christine Hau-Riege, You-Wen Yau, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

A study of wafer level package board level reliability

Christine Hau-Riege, You-Wen Yau, Steven X. Xu, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.