Qiaowei Lou

Strategies for aggressive scaling of EUV multi-patterning to sub-20 nm features

Joe Lee, Akiteru Ko, Cody Murray, 2020, Advanced Lithography.

Line edge roughness reduction for EUV self-aligned double patterning by surface modification on spin-on-carbon and tone inversion technique

Peter Biolsi, Angélique Raley, Gregory Denbeaux, 2021 .

Silicon nitride and silicon etching by CH3F/O2 and CH3F/CO2 plasma beams

Vincent M. Donnelly, Qiaowei Lou, Demetre J. Economou, 2016 .