Sang-Won Kim

Transient Stability Constrained Optimal Power Flow in Mixed AC/Multi‐Terminal VSC HVDC System

Yoshio Izui, Kazuyuki Mori, Tomihiro Takano, 2020 .

Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging

Seung-Boo Jung, Sang-Won Kim, Jeong-Won Yoon, 2005 .

Numerical Evaluation Method of CED in Piezoelectric Materials and Influence of Loading History on Their Values

Nobuhiro Yoshikawa, Sang-Won Kim, Katsuhiko Watanabe, 2013 .

IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate

Seung-Boo Jung, Sang-Won Kim, Jeong-Won Yoon, 2005 .

IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging

Seung-Boo Jung, Sang-Won Kim, Jeong-Won Yoon, 2004 .

Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder

Dae-Gon Kim, Seung-Boo Jung, Sang-Won Kim, 2004 .

Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization

Seung-Boo Jung, Sang-Won Kim, Jeong-Won Yoon, 2004 .