R. Yang

3D Printed Template-Assisted Assembly of Additive-Free Ti3C2Tx MXene Microlattices with Customized Structures toward High Areal Capacitance.

Guangmin Zhou, Xin Wu, Heyi Xia, 2022, ACS nano.

Silver pastes with excellent thermal conductivity

Cheng Yang, Rui Yang, Dang Wu, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Low-Temperature Fusible Silver Micro/Nanodendrites-Based Electrically Conductive Composites for Next-Generation Printed Fuse-Links.

Yang Wang, Xuanyu Wang, Cheng Yang, 2017, ACS nano.

Scalable synthesis of monodispersed branched submicron silver particles as the printed electrically conductive adhesives fillers

Cheng Yang, Dang Wu, Yubin Deng, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Silver dendrite-based nanocomposites for current cutting-off fuse

Cheng Yang, Zhexu Zhang, Rui Yang, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Silver Dendrite-based Nanocomposites for Current

Zhexu Zhang, Xiaoya Cui, C. Y. Ang, 2015 .

Scalable synthesis and application of mono-dispersed hierarchical silver micro-particles

Yang Wang, Cheng Yang, Rui Yang, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Flexible copper wires through galvanic replacement of zinc paste: a highly cost-effective technology for wiring flexible printed circuits

F. Kang, Ching-ping Wong, Ziyin Lin, 2015 .

Low-Temperature Fusible Silver Micro/Nanodendrites-Based Electrically Conductive Composites for Next-Generation Printed Fuse-Links.

Yang Wang, Xuanyu Wang, Cheng Yang, 2017, ACS nano.

Performance characterization of drop-on-demand micro-dispensing system with multi-printheads

Jie Sun, Rui Yang, Yoke San Wong, 2010 .