A. J. Steckl

The trials of wafer-scale integration: Although major technical problems have been overcome since WSI was first tried in the 1960s, commercial companies can't yet make it fly

J. F. McDonald, E. H. Rogers, K. Rose, 1984, IEEE Spectrum.

Circuits on cellulose

A. J. Steckl, A. Steckl, 2013, IEEE Spectrum.

Two‐dimensional Haar thinning for data base compaction in Fourier proximity correction for electron beam lithography

J. F. McDonald, A. J. Steckl, D. C. King, 1985 .

56.3: Electrowetting Light Valves with Greater than 80% Transmission, Unlimited View Angle, and Video Response

A. J. Steckl, J. Heikenfeld, 2005 .

Epitaxial growth of beta -SiC on Si by RTCVD with C/sub 3/H/sub 8/ and SiH/sub 4/

A. J. Steckl, A. Steckl, J. P. Li, 1992 .

Comparison of NPN transistors fabricated with broad beam and spatial profiling using focused beam ion implantation

Robert H. Reuss, David B. Rensch, A. J. Steckl, 1986 .

Effect of trimethylsilane flow rate on the growth of SiC thin-films for fiber-optic temperature sensors

A. J. Steckl, James D. Scofield, A. Steckl, 2003 .