Vinayak Pandey

3DIC: An Industry Overview

Vinayak Pandey, 2019 .

Innovative Integration Solutions for SiP Packages Using Fan-Out Wafer Level eWLB Technology

Vinayak Pandey, Jacinta Aman Lim, 2017 .

Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for Low Cost and High Performance Flip Chip Package

Nokibul Islam, Vinayak Pandey, KyungOe Kim, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Minimum Requirements for a Successful Automotive Qualification With Focus on Packaging

Vinayak Pandey, 2019 .

Fan-out Wafer Level eWLB Technology as an Advanced System-in- Package Solution

Vinayak Pandey, Andy Yong, Aung Kyaw Oo, 2017 .