Suk-Jin Ham

Fine leak batch testing of multiple MEMS packages

Bongtae Han, Byeng D. Youn, Changsoo Jang, 2009, MOEMS-MEMS.

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Suk-Jin Ham, Woon-Seong Kwon, Soon-Bok Lee, 2005 .

Experimental Techniques for Fatigue Reliability of BGA Solder Bumps in Electronic Packaging.

Suk-Jin Ham, Soon-Bok Lee, Tae-Sang Park, 2000 .

Reliability Verification of Hermetic Package With Nanoliter Cavity for RF-Micro Device

Byung-Sung Kim, Suk-Jin Ham, Byung-Gil Jeong, 2010, IEEE Transactions on Advanced Packaging.

A study on the thermal deformation of ACF assemblies using moire interferometry and FEM

Suk-Jin Ham, Tae-Kyung Hwang, Soon-Bok Lee, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).

In situ measurement of gas diffusion properties of polymeric seals used in MEMS packages by optical gas leak testing

Bongtae Han, Changsoo Jang, Suk-Jin Ham, 2009 .