J. Lohan

Visualization of forced air flows over a populated printed circuit board and their impact on convective heat transfer

J. Lohan, V. Eveloy, P. Rodgers, 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

Experimental validation of numerical heat transfer predictions for singleand multi-component printed circuit boards in natural convection environments

J. Lohan, V. Eveloy, P. Rodgers, 1999, Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306).

Effect of both PCB thermal conductivity and nature of forced convection environment on component operating temperature: Experimental measurement and numerical prediction

J. Lohan, C.-M. Fager, P. Tiilikka, 2000, Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068).

Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection

Peter Rodgers, J. Lohan, C.-M. Fager, 2000 .

Thermal challenges in next generation electronic systems - summary of panel presentations and discussions

Suresh V. Garimella, Bahgat Sammakia, Martine Baelmans, 2002 .

Comparison of numerical predictions and experimental measurements for the transient thermal behavior of a board-mounted electronic component

J. Lohan, P. Rodgers, Valerie Eveloy, 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

Using experimental analysis to evaluate the influence of printed circuit board construction on the thermal performance of four package types in both natural and forced convection

Peter Rodgers, J. Lohan, C.-M. Fager, 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).

Impact of convective environment on the distribution of heat transfer from three electronic component package types : Operating on single- and multi-component printed Circuit boards

Peter Rodgers, J. Lohan, C.-M. Fager, 1999 .

Transient thermal behaviour of a board-mounted 160-lead plastic quad flat pack

Mark Davies, J. Lohan, 1994, Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM).

The thermal characteristics of a board-mounted 160 lead plastic quad flat pack.

Mark Davies, Jeff Punch, T. Moore, 1994 .