B. Brackett

85/spl deg/C and 125/spl deg/C probe with enhanced reliability screens (activities of the Sematech PTAB for die level product assurance)

R. Arnold, B. Brackett, S. Siddiqui, 1997, Proceedings 1997 International Conference on Multichip Modules.

Test methods used to produce highly reliable known good die (KGD)

R. Arnold, B. Brackett, S. M. Menon, 1998, Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154).