Hun Shen Ng
发表
Zhong Chen,
Shu Min Lim,
Hun Shen Ng,
2009,
2009 11th Electronics Packaging Technology Conference.
Hun Shen Ng,
E. Hussa,
X. Baraton,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
R. Tiziani,
G. Santospirito,
Hun Shen Ng,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
Zhaowei Zhong,
Hun Shen Ng,
Tong Yan Tee,
2003,
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
Ahmer Syed,
Hun Shen Ng,
Choong Peng Khoo,
2010,
Microelectron. Reliab..
Xueren Zhang,
Hun Shen Ng,
Jing-en Luan,
2005,
2005 7th Electronic Packaging Technology Conference.
Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages
Zhaowei Zhong,
Hun Shen Ng,
Tong Yan Tee,
2003,
Microelectron. Reliab..
Hun Shen Ng,
Jing-en Luan,
Tong Yan Tee,
2004,
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
Ahmer Syed,
Hun Shen Ng,
Tong Yan Tee,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Daniel Yap,
Hun Shen Ng,
Tong Yan Tee,
2004,
SPIE Optical Systems Design.
Zhaowei Zhong,
Jiang Zhou,
Hun Shen Ng,
2006
.
Zhaowei Zhong,
Giovanni Frezza,
Hun Shen Ng,
2003,
Int. J. Comput. Eng. Sci..
Zhaowei Zhong,
R. Bond,
Hun Shen Ng,
2004,
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
Zhaowei Zhong,
Hun Shen Ng,
Tong Yan Tee,
2006,
Microelectron. Reliab..
Tong Yan,
Long Bin,
Hun Shen Ng,
2010
.
Hun Shen Ng,
Jing-en Luan,
Tong Yan Tee,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
Jong Heon Kim,
In Soo Kang,
Teck Kheng Lee,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Zhaowei Zhong,
Chwee Teck Lim,
Hun Shen Ng,
2004,
Microelectron. Reliab..
Jong Heon Kim,
In Soo Kang,
Teck Kheng Lee,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
R. Anderson,
Hun Shen Ng,
Choong Peng Khoo,
2008,
2008 10th Electronics Packaging Technology Conference.
T. Reinikainen,
Hun Shen Ng,
E. Hussa,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
Hun Shen Ng,
J. Teysseyre,
Tong Yan Tee,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
Hun Shen Ng,
Tong Yan Tee,
T. Y. Tee,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).