H. Ji

发表

Effects of ultrasonic irradiation and cooling rate on the solidification microstructure of Sn–3.0Ag–0.5Cu alloy

Chunqing Wang, Hongjun Ji, Mingyu Li, 2014 .

Fabrication of Ni60–SiC coating on carbon steel for improving friction, corrosion properties

Hongjun Ji, Mingyu Li, Y. Cui, 2017 .

Wearable Circuits Sintered at Room Temperature Directly on The Skin Surface for Health Monitoring.

Hongjun Ji, Mingyu Li, Huanyu Cheng, 2020, ACS applied materials & interfaces.

Dendrite evolution and quantitative characterization of γ′ precipitates in a powder metallurgy Ni-based superalloy by different cooling rates

Lihua Zhu, Jianzheng Guo, Junyi Cheng, 2022, Journal of Alloys and Compounds.

Size-dependent microstructure evolution and formation mechanisms during the gas atomization process of FGH4113A Ni-based superalloy powder

Lihua Zhu, Junyi Cheng, Lei Xiao, 2022, Vacuum.

Low-temperature joining of Fe-based amorphous foil with aluminum by ultrasonic-assisted soldering with Sn-based fillers

Hongjun Ji, Mingyu Li, Long Li, 2015 .

Abnormal dislocation substructure in the ultrasonically welded joints of Cu single crystals

Jianli Zhou, Qiuchen Ma, Jingyuan Ma, 2022, Science and Technology of Welding and Joining.

Evolution of the bulk microstructure in 1100 aluminum builds fabricated by ultrasonic metal welding

Mingyu Li, Hongjun Ji, Hongjun Ji, 2014 .

Microstructure evolution in cooling process of Al–Zn–Mg–Cu alloy and kinetics description

Hongjun Ji, Yuhe Zhang, Shu-cai Yang, 2012 .

The Authors Declare that They Have No Known Competing Financial Interests or Personal Relationships that Could Have Appeared to Influence the Work Reported in this Paper

Hongjun Ji, Qinmiao Sun, Wanchun Yang, 2022, SSRN Electronic Journal.

An invisible private 2D barcode design and implementation with tunable fluorescent nanoparticles

Dandan Xu, Jiaheng Zhang, Weiwei Zhao, 2019, RSC advances.

Droplet‐based microfluidics systems in biomedical applications

Jinhong Guo, Tingting Zheng, Mingyu Li, 2019, Electrophoresis.

Ultrasonic-Accelerated Intermetallic Joint Formation with Composite Solder for High-Temperature Power Device Packaging

Mingyu Li, Wenwu Zhang, Weiwei Zhao, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Microstructure evolution, interfacial reaction and mechanical properties of lead-free solder bump prepared by induction heating method

Mingyu Li, Yong-Ho Ko, Hongjun Ji, 2016 .

Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering

Mingyu Li, Y. Ko, Chang-Woo Lee, 2016 .

Ultrasonic-assisted soldering of Sn/Ni composite solder during die bonding for high-temperature application

Minggang Li, Mingyu Li, H. Ji, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Ultrasonic-accelerated metallurgical reaction of Sn/Ni composite solder: Principle, kinetics, microstructure, and joint properties.

Hongjun Ji, Mingyu Li, Wenwu Zhang, 2020, Ultrasonics sonochemistry.

Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging.

Mingyu Li, Hongjun Ji, Meng Liang, 2018, Ultrasonics sonochemistry.

Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application

Hongjun Ji, Mingyu Li, Yunfei Qiao, 2016 .

Ultrafine-Grain and Isotropic Cu/SAC305/Cu Solder Interconnects Fabricated by High-Intensity Ultrasound-Assisted Solidification

Chunqing Wang, Hongjun Ji, Mingyu Li, 2014, Journal of Electronic Materials.

Effect of the Silver Content of SnAgCu Solder on the Interfacial Reaction and on the Reliability of Angle Joints Fabricated by Laser-Jet Soldering

Chunqing Wang, Hongjun Ji, Mingyu Li, 2015, Journal of Electronic Materials.

Comparison of Bond Interface Reaction in Al-Ni and Al-Au Systems Formed by Ultrasonic Wedge Bonding

Chunqing Wang, Mingyu Li, H. Ji, 2006, 2006 International Conference on Electronic Materials and Packaging.

Interdiffusion of Al-Ni system enhanced by ultrasonic vibration at ambient temperature.

Chunqing Wang, Mingyu Li, H. Bang, 2006, Ultrasonics.

Microstructure and Property of Au stud/Lead-free solder composite joint

Hongjun Ji, Yong-zhong Zhang, Jiao-Long Wang, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

Microstructure and reliability of hybrid interconnects by Au stud bump with Sn-0.7Cu solder for flip chip power device packaging

Mingyu Li, Jiao Wang, Hongjun Ji, 2016, Microelectron. Reliab..

Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticles

Chunqing Wang, Hongjun Ji, Mingyu Li, 2012 .

Ni3Sn4-composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging

Hongjun Ji, Mingyu Li, Minggang Li, 2016 .

Enhanced antioxidant and size controllable Cu@Ag core-shell nanoparticles conductive inks for flexible printed electronics

Mingyu Li, Wenwu Zhang, Yichen Cao, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

Enhancing the solid/liquid interfacial metallurgical reaction of Sn+Cu composite solder by ultrasonic-assisted chip attachment

Hongjun Ji, Mingyu Li, Jiayi Huang, 2019, Journal of Alloys and Compounds.

Rapid soldering of flexible graphene assembled films at low temperature in air with ultrasonic assistance

Hongjun Ji, Daping He, Zhe Wang, 2020 .

Microstructure and joint properties of ultrasonically brazed Al alloy joints using a Zn-Al hypereutectic filler metal

Hongjun Ji, Mingyu Li, Jongmyung Kim, 2013 .

Additively Fabricated Electronic Skin with High Performance in Dynamic Sensing as Human Skin

H. Feng, Jun Wei, Shuaishuai Meng, 2023, ACS Applied Electronic Materials.

A template self-assembly strategy to synthesize free-standing TiO2–MO (M = Mg, Co, Ni, Cu or Zn) colloidal films

Hongjun Ji, Xin Wang, Xiaoheng Liu, 2011 .

Highly Conductive Cu-Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles.

Mingyu Li, Jingdong Liu, Hongtao Chen, 2016, ACS applied materials & interfaces.

The low temperature exothermic sintering of formic acid treated Cu nanoparticles for conductive ink

Hongjun Ji, Mingyu Li, Jingdong Liu, 2016, Journal of Materials Science: Materials in Electronics.

Additively Manufactured Flexible Electronics with Ultrabroad Range and High Sensitivity for Multiple Physiological Signals' Detection

Hongjun Ji, Jiaheng Zhang, H. Feng, 2022, Research.

Ultrasonic-Excited Ultrafast Seamless Integration of Heterostructured Liquid Crystalline Elastomers for Multi-responsive Soft Actuators.

Yan Huang, Mingyu Li, Xiaoxiong Zheng, 2023, ACS applied materials & interfaces.

Effects of ozonation on disinfection by-product formation potentials and biostability in a pilot-scale drinking water treatment plant with micro-polluted water

Hongjun Ji, R. Yu, Huan Gao, 2020, Environmental technology.

ZrO2–SnO2 nanocomposite film containing superlattice ribbons

Hongjun Ji, Xin Wang, Xiaoheng Liu, 2010 .

Large-area flexible and transparent UV photodetector based on cross-linked Ag NW@ZnO NRs with high performance

Mingyu Li, H. Feng, Weiwei Zhao, 2021, Journal of Materials Science & Technology.

Self-assembly of nickel: from nanoparticles to foils with tunable magnetic properties

Lang Chen, Hongjun Ji, Xing Ma, 2019, CrystEngComm.

Microstructures and properties of the Fe-based amorphous foil/aluminum dissimilar joint by ultrasonic-assisted soldering

Hongjun Ji, Mingyu Li, Long Li, 2015, Welding in the World.

Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging

Chunqing Wang, Hongjun Ji, Mingyu Li, 2013 .

Effects of oxygen/argon ratio and annealing on structural and optical properties of ZnO thin films

Hongjun Ji, Bing Zhou, Xiaohong Jiang, 2012 .

Mechanism of Ni3Sn4 rapid formation of Sn-Ni mixed particles paste in ultrasound-assisted TLP for power electronic chip attachment

Hongjun Ji, Mingyu Li, Jiayi Huang, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Low energy ultrasonic welding for Cu-Cu joining accelerated via Cu Nanoparticles

Mingyu Li, Wenwu Zhang, Hongtao Chen, 2021 .

Size-Dependent Phase Transformation during Gas Atomization Process of Cu–Sn Alloy Powders

Hongjun Ji, Mingyu Li, M. Liang, 2019, Materials.

Deep crystallization induced high thermal conductivity of low-temperature sintered Ag nanoparticles

Hongjun Ji, Mingyu Li, Jongmyung Kim, 2014 .

Dimeric sodium naphthalene-1-sulfonate aggregates guided self-assembly of TiO2/naphthylene hybrid nanocomposite film

Hongjun Ji, Xiaodong Wu, Xin Wang, 2009 .

Multi-layer silver nanowire/polyethylene terephthalate mesh structure for highly efficient transparent electromagnetic interference shielding

Hongjun Ji, Jiahui Gu, H. Feng, 2020, Nanotechnology.

Dynamic Weld evolution during ultrasonic welding of Cu–Al joints

Hongjun Ji, Jianli Zhou, Qiuchen Ma, 2021, Materials Science and Engineering: A.

Influence of counter-ions on the self-assembly of ZrO2 nanodisks.

Hongjun Ji, Xin Wang, Xiaoheng Liu, 2011, Journal of colloid and interface science.

Highly Sensitive and Transparent Strain Sensors with an Ordered Array Structure of AgNWs for Wearable Motion and Health Monitoring

Mingyu Li, Jiayi Huang, Hao Liu, 2019, Scientific Reports.

Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn–3Al filler metal

Hongjun Ji, Mingyu Li, Jongmyung Kim, 2013 .

Effects of different anionic surfactant templates (H+A−, Na+A−) on titanium self-assembly: In the air–water interfacial films

Hongjun Ji, Xin Wang, Xiaoheng Liu, 2007 .

Mechanical properties and microstructures of hybrid ultrasonic resistance brazing of WC-Co/BeCu

Chunqing Wang, Mingyu Li, Y. Lu, 2012 .

Nano oxide intermediate layer assisted room temperature sintering of ink-jet printed silver nanoparticles pattern

Hongjun Ji, Mingyu Li, Xing Ma, 2019, Nanotechnology.

A wearable real-time power supply with a Mg3Bi2-based thermoelectric module

Xiaofang Li, Hongjun Ji, Wenwu Zhang, 2021, Cell Reports Physical Science.

Surface metallization of Si3N4 ceramics with high-performance silver thick paste containing Bi-B-Zn glass frit

Hongjun Ji, Mingyu Li, Yufeng Li, 2023, Journal of Materials Science.

Microstructure evolution and bonding mechanism of ZrO2 ceramic and Ti-6Al-4V alloy joints brazed by Bi2O3-B2O3-ZnO glass paste

Hongjun Ji, Qinmiao Sun, Wanchun Yang, 2022, Journal of the European Ceramic Society.

A flexible and conductive metallic paper-based current collector with energy storage capability in supercapacitor electrodes.

Hongjun Ji, Xing Ma, Jiaheng Zhang, 2019, Dalton transactions.

Pressureless low temperature sintering of Ag nanoparticles for interconnects

Hongjun Ji, Mingyu Li, Jongmyung Kim, 2012 .

Facile Gold-Nanoparticle Boosted Graphene Sensor Fabrication Enhanced Biochemical Signal Detection

Hongjun Ji, Xing Ma, Jiaheng Zhang, 2022, Nanomaterials.

Overwhelming reaction enhanced by ultrasonics during brazing of alumina to copper in air by Zn-14Al hypereutectic filler.

Hongjun Ji, Mingyu Li, Hao Chen, 2017, Ultrasonics sonochemistry.

Effect of ultrasonic transmission rate on microstructure and properties of the ultrasonic-assisted brazing of Cu to alumina.

Hongjun Ji, Mingyu Li, Hao Chen, 2017, Ultrasonics sonochemistry.

Sintering mechanism of size-controllable Cu-Ag core-shell nanoparticles for flexible conductive film with high conductivity, antioxidation, and electrochemical migration resistance

Hongjun Ji, Linlin Song, Wenwu Zhang, 2022, Applied Surface Science.

Intrinsic Dependence of Welding Quality and Recrystallization on the Surface-contacted Micro-asperity Scale during Ultrasonic Welding of Cu–Cu Joints

Hongjun Ji, Qiuchen Ma, Jianli Zhou, 2022, Journal of Materials Research and Technology.

Dislocation behavior in Cu single crystal joints under the ultrasonically excited high-strain-rate deformation

Hongjun Ji, Xiaoxiong Zheng, Jianli Zhou, 2022, Journal of Materials Science & Technology.

Tailoring thermal behavior and solid–liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process

Mingyu Li, Lihua Zhu, Dashi Lu, 2023, Journal of Materials Science: Materials in Electronics.

A facile fabrication of conjugated fluorescent nanoparticles and micro-scale patterned encryption via high resolution inkjet printing.

Min Wang, H. Feng, Weiwei Zhao, 2021, Nanoscale.

Self-assembly of disk-like multiring ZnO-SnO2 colloidal nanoparticles.

Xin Wang, Xiaoheng Liu, Xiutao Ge, 2011, Journal of colloid and interface science.

Evolution of the bond interface during ultrasonic Al–Si wire wedge bonding process

Mingyu Li, Jingwei Guan, Hongjun Ji, 2007 .

Microstructures and properties of alumina/copper joints fabricated by ultrasonic-assisted brazing for replacing DBC in power electronics packaging

Mingyu Li, Hao Chen, H. Ji, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Ultrafast ultrasonic-assisted joining of bare α-alumina ceramics through reaction wetting by aluminum filler in air

Hongjun Ji, Mingyu Li, C. Xiao, 2016 .

Silver‐Nanowire Mesh‐Structured Transparent Conductive Film with Improved Transparent Conductive Properties and Mechanical Performance

Hongjun Ji, Xing Ma, Jun Wei, 2019, Advanced Materials Technologies.

Highly stretchable patternable conductive circuits and wearable strain sensors based on polydimethylsiloxane and silver nanoparticles

Xing Ma, Ling Zhang, Jiaheng Zhang, 2019, Nanotechnology.

Ultrasonic-induced deformation nanostructures in coarse-grained aluminum wires at room temperature

Chunqing Wang, Mingyu Li, H. Ji, 2012 .

Interfacial microstructure and mechanical properties of ultrasonic-assisted brazing joints between Ti–6Al–4V and ZrO2

Hongjun Ji, Mingyu Li, Hongbo Xu, 2020 .

Dissolution and nucleation behavior of Al in Ta/Sn/Al joints during ultrasonic-assisted soldering

Mingyu Li, Zhihong Wang, Haifeng Yang, 2019, Materials Letters.

Enhanced Electrical and Mechanical Properties of a Printed Bimodal Silver Nanoparticle Ink for Flexible Electronics

Hongjun Ji, Y. Huang, H. Feng, 2018, physica status solidi (a).

Low-temperature sintering of Ag nanoparticles for high-performance thermoelectric module design

Z. Ren, F. Yang, Qian Zhang, 2023, Nature Energy.

Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

Mingyu Li, Qiang Wang, H. Ji, 2015, Journal of Electronic Materials.

Ultrasonic-Assisted Soldering of Sn-Based Solder Alloys to Form Intermetallic Interconnects for High Temperature Application

Hongjun Ji, Mingyu Li, Yunfei Qiao, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Rapid formation of intermetallic joints with Sn/metal composite alloys by ultrasonic-assisted soldering for high-temperature chip attachment

Hongjun Ji, Minggang Li, Mingyu Li, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Microstructural evolution and degradation mechanism of SiC–Cu chip attachment using sintered nano-Ag paste during high-temperature ageing

Mingyu Li, C. Hang, Fan Yang, 2020 .

Conductivity enhancement of silver nanowire networks via simple electrolyte solution treatment and solvent washing

Hongjun Ji, Mingyu Li, Xing Ma, 2018, Nanotechnology.

Rapid formation of Cu–Cu joints with high shear strength using multiple-flocculated Ag nanoparticle paste

Mingyu Li, Fan Yang, Shihua Yang, 2019, Journal of Materials Science: Materials in Electronics.

A supersaturated Cu-Ag nanoalloy joint with ultrahigh shear strength and ultrafine nanoprecipitates for power electronic packaging

Hongjun Ji, Wenwu Zhang, Xiangli Liu, 2023, Journal of Materials Science & Technology.

Highly Sensitive and Transparent Strain Sensors with an Ordered Array Structure of AgNWs for Wearable Motion and Health Monitoring

Mingyu Li, Jiayi Huang, Hao Liu, 2019, Scientific Reports.

Ultralight and Highly Conductive Silver Nanowire Aerogels for High-Performance Electromagnetic Interference Shielding.

Hongjun Ji, C. Hang, Hongtao Chen, 2023, ACS applied materials & interfaces.

The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding

Mingyu Li, Zhi-Quan Liu, M. Wen, 2018, Journal of Materials Science: Materials in Electronics.

Ultrasound-induced interinhibitive dissolution-precipitation evolution and significantly improved mechanical properties of Kovar/SnSb10 assembly

Hongjun Ji, Mingyu Li, Yufeng Li, 2023, Journal of Materials Research and Technology.

Effect of glucose on self-assembly of free-standing air–water interfacial lamellar ZrO2 films

Hongjun Ji, Xin Wang, Xiaoheng Liu, 2011 .

The diffusion of Ni into Al wire at the interface of ultrasonic wire bond during high temperature storage

Chunqing Wang, Mingyu Li, Dongqing Li, 2005, 2005 6th International Conference on Electronic Packaging Technology.

Ultrasound-induced equiaxial flower-like CuZn5/Al composite microstructure formation in Al/Zn–Al/Cu joint

Hongjun Ji, Mingyu Li, Jongmyung Kim, 2014 .

Highly flexible electromagnetic interference shielding films based on ultrathin Ni/Ag composites on paper substrates

Hongjun Ji, Mingyu Li, Xiangli Liu, 2020, Journal of Materials Science.

Superelastic, Highly Conductive, and Superhydrophobic Silver Nanowires/Polypyrrole Hybrid Aerogels with Outstanding Electromagnetic Interference Shielding and Joule Heating Performance

C. Hang, Wenbo Zhu, Bicheng Fu, 2023, Journal of Materials Chemistry A.

Self-assembly and photocatalytic property of amorphous cubic-like TiO2-ZnO hybrid film

Xin Wang, Xiaoheng Liu, Xiaxi Yao, 2011 .