C. Farcas

发表

D. Petreus, I. Ciocan, C. Farcas, 2006, 2006 29th International Spring Seminar on Electronics Technology.

C. Farcas, M. Crasi, N. Palaghita, 2004, 27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004..

I. Ciocan, C. Farcas, R. Fizesan, 2015, 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME).

D. Petreus, I. Ciocan, C. Farcas, 2006, 2006 1st Electronic Systemintegration Technology Conference.

I. Ciocan, C. Farcas, N. Palaghita, 2013, 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME).

D. Pitica, P. Svasta, C. Farcas, 2007, 2007 30th International Spring Seminar on Electronics Technology (ISSE).

C. Farcas, A. Tulbure, S. Doaga, 2018, 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging​ (SIITME).

D. Petreus, C. Farcas, O. Pop, 2009, 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME).

D. Petreus, C. Farcas, N. Palaghita, 2006, 2006 29th International Spring Seminar on Electronics Technology.

D. Petreus, C. Farcas, N. Palaghita, 2006, 2006 IEEE International Conference on Automation, Quality and Testing, Robotics.

A. Grama, D. Petreus, I. Ciocan, 2012, 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME).

D. Petreus, I. Ciocan, C. Farcas, 2008, 2008 31st International Spring Seminar on Electronics Technology.

D. Petreus, I. Ciocan, C. Farcas, 2009, 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME).

D. Petreus, I. Ciocan, C. Farcas, 2008, 2008 2nd Electronics System-Integration Technology Conference.

C. Farcas, D. Petreus, C. Vlad, 1999, ICECS'99. Proceedings of ICECS '99. 6th IEEE International Conference on Electronics, Circuits and Systems (Cat. No.99EX357).

A. Grama, C. Farcas, N. Palaghita, 2014, 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME).