Julie Roullard

Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits

Pascal Ancey, Alexandre Valentian, Patrick Leduc, 2009, 2009 IEEE International Conference on 3D System Integration.

Some Strategic Tracks to Optimize Routing of High Speed Signal Transmission Between Memory and Logic in 3D-IC Stacks

C. Ferrandon, Thierry Lacrevaz, Bernard Flechet, 2013 .

Influence of 3D integration on 2D interconnections and 2D self inductors HF properties

Thierry Lacrevaz, Lionel Cadix, Alexis Farcy, 2009, 2009 IEEE International Conference on 3D System Integration.