Kuo-Shu Kao

发表

600V, 450A IGBT power module for 50kw electrical vehicle

Kuo-Shu Kao, Tao-Chih Chang, Wei Li, 2013, 2013 4th IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG).

Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration

Kuo-Shu Kao, Tao-Chih Chang, Ren-Shin Cheng, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Assembly and reliability assessment of 50µm-thick chip stacking by wafer-level underfill film

Kuo-Shu Kao, Ren-Shin Cheng, Tsung-Fu Yang, 2012, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration

Kuo-Shu Kao, J. H. Lau, Chau-Jie Zhan, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Achievement of low temperature chip stacking by a wafer-applied underfill material

Kuo-Shu Kao, Yin-Po Hung, Ren-Shin Cheng, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Reliability enhancements of chip-on-chip package with layout designs of microbumps

Kuo-Shu Kao, Ren-Shin Cheng, Chau-Jie Zhan, 2014 .

Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections

Kuo-Shu Kao, J. H. Lau, Chau-Jie Zhan, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP

Kuo-Shu Kao, Heng-Chieh Chien, J. H. Lau, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30μm pitch lead-free solder micro bumps and reliability characterization

Kuo-Shu Kao, Tai-Hong Chen, John H. Lau, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Investigation of pre-bending substrate design in packaging assembly of an IGBT power module

Kuo-Shu Kao, Leon Lin, Fang-Jun Leu, 2014 .

Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration

Kuo-Shu Kao, Ren-Shin Cheng, John H. Lau, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Development of packaging technologies for SiC power module

Kuo-Shu Kao, Wei Li, Chun-Kai Liu, 2015, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Reliable microjoints for chip stacking formed by solid-liquid interdiffusion (SLID) bonding

Kuo-Shu Kao, Yin-Po Hung, Ren-Shin Cheng, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).