Sheng-Tsai Wu

发表

Design and simulation study for stacked IC packages with spacer structure

Sheng-Tsai Wu, Ming-Che Hsieh, 2009, 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.

Energy Release Rate Estimation for Through Silicon Vias in 3-D IC Integration

Sheng-Tsai Wu, John H. Lau, Ming-Che Hsieh, 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Equivalent mechanical properties of through silicon via interposers - A unit model approach

Sheng-Tsai Wu, Cheng-fu Chen, Sheng-Tsai Wu, 2015, Microelectron. Reliab..

Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300mm Multi-Project Wafer (MPW)

Sheng-Tsai Wu, John H. Lau, T.-H. Chen, 2011 .

Evaluation of Temperature-Dependent Effective Material Properties and Performance of a Thermoelectric Module

Sheng-Tsai Wu, Heng-Chieh Chien, Ming-Ji Dai, 2013, Journal of Electronic Materials.

Energy release rate investigation for through silicon vias (TSVs) in 3D IC integration

Sheng-Tsai Wu, John H. Lau, Ra-Min Tain, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Ultra low-cost through-silicon holes (TSHs) interposers for 3D IC integration SiPs

Sheng-Tsai Wu, Heng-Chieh Chien, J. H. Lau, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Thermo-mechanical analysis and interfacial energy release rate estimation for metal-insulator-metal capacitor device

Sheng-Tsai Wu, Ra-Min Tain, Ming-Che Hsieh, 2011 .

Thermo-mechanical simulative study for 3D vertical stacked IC packages with spacer structures

Sheng-Tsai Wu, Ming-Che Hsieh, Chih-Kuang Yu, 2010, 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

Design, fabrication, and calibration of stress sensors embedded in a TSV interposer in a 300mm wafer

Sheng-Tsai Wu, Heng-Chieh Chien, J. H. Lau, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Interplay and influence of thermomechanical stress in copper-filled TSV interposers

Sheng-Tsai Wu, Heng-Chieh Chien, Cheng-fu Chen, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Thermo-mechanical analysis of thermoelectric modules

Sheng-Tsai Wu, Ming-Ji Dai, Ming-Che Hsieh, 2010, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

Thermal and mechanical design and analysis of 3D IC interposer with double-sided active chips

Sheng-Tsai Wu, John H. Lau, Heng-Chieh Chien, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)

Sheng-Tsai Wu, John H. Lau, Heng-Chieh Chien, 2011 .