Tzu-Ying Kuo

发表

Design and implementation of ultra-thin SiP modules

Yung-Chung Chang, Wei-Ting Chen, Chang-Sheng Chen, 2012, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Development of double-sided with double-chip stacking structure using panel level embedded wafer level packaging

Kuo-Ning Chiang, Yen-Fu Su, Tzu-Ying Kuo, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Development of the three dimensional multi-electrode array for neural recording

Shao-Wei Lu, Weileun Fang, Tzu-Ying Kuo, 2005, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05..

Development and characterization of rigid-flex interface

Tai-Hong Chen, Shu-Ming Chang, Wei-Chung Lo, 2006, 56th Electronic Components and Technology Conference 2006.

Design and fabrication of novel three-dimensional multi-electrode array using SOI wafer

Shao-Wei Lu, Weileun Fang, Tzu-Ying Kuo, 2006 .

Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage design

Tzong-Lin Wu, Yi-Chang Lu, Chau-Jie Zhan, 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.

Next Standard Packaging Method for DRAM - Chip-in-Substrate Package

Tao-Chih Chang, Cheng-Ta Ko, Yu-Hua Chen, 2006, 2006 International Microsystems, Package, Assembly Conference Taiwan.

3D Chip-to-Chip Stacking with Through Silicon Interconnects

Shu-Ming Chang, Hsiang-Hung Chang, Wei-Chung Lo, 2007, 2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).

Flexible and ultra-thin embedded chip package

Hsiang-Hung Chang, Cheng-Ta Ko, Yu-Hua Chen, 2009, 2009 59th Electronic Components and Technology Conference.

A novel micromachined flow sensor using periodic flapping motion of a planar jet impinging on a V-shaped plate

Gwo-Bin Lee, Tzu-Ying Kuo, Wan-Yu Wu, 2002 .

Thermal Effect Characterization of Laser-Ablated Silicon-Through Interconnect

Wei-Chung Lo, Yu-Hua Chen, Tzu-Ying Kuo, 2006, 2006 1st Electronic Systemintegration Technology Conference.

The evaluation of wafer thinning and singulating processes to enhance chip strength

Tzu-Ying Kuo, Hsu-Tien Hu, Jyh-Rong Lin, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Process and characterization of ultra-thin film packages

Yin-Po Hung, Wei Li, Cheng-Ta Ko, 2010, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

Embedded active device packaging technology for next-generation chip-in-substrate package, CiSP

Cheng-Ta Ko, Yu-Hua Chen, Tzu-Ying Kuo, 2006, 56th Electronic Components and Technology Conference 2006.

Development and characterization of low cost ultrathin 3D interconnect

Wei-Chung Lo, Yu-Hua Chen, Tzu-Ying Kuo, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

An innovative chip-to-wafer and wafer-to-wafer stacking

Wei-Chung Lo, Su-Tsai Lu, Yu-Hua Chen, 2006, 56th Electronic Components and Technology Conference 2006.

Chip-in-substrate package, CiSP, technology

A. Ostmann, A. Neumann, Cheng-Ta Ko, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).