Brandon Passmore

发表

High-frequency AC-DC conversion with a silicon carbide power module to achieve high-efficiency and greatly improved power density

Alexander B. Lostetter, Bret Whitaker, Adam Barkley, 2013, 2013 4th IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG).

Design and Development of a Low Cost Manufacturable High Voltage Power Module for Energy Storage Systems.

Stanley Atcitty, Brandon Passmore, 2012 .

An integrated gate driver in 4H-SiC for power converter applications

H. Alan Mantooth, Charles L. Britton, Sei-Hyung Ryu, 2014, 2014 IEEE Workshop on Wide Bandgap Power Devices and Applications.

Next-generation MVDC architecture based on 6.5 kV / 200 A, 12.5 mΩ SiC H-bridge and 10 kV / 240 A, 20 mΩ SiC dual power modules

H. Alan Mantooth, Yusi Liu, Jonathan Hayes, 2017, 2017 IEEE Electric Ship Technologies Symposium (ESTS).

System-Level Packaging of Wide Bandgap Inverters for Electric Traction Drive Vehicles

P. Killeen, Kenny George, Tom Flint, 2015 .

Design of a 250 kW, 1200 V SiC MOSFET-based three-phase inverter by considering a subsystem level design optimization approach

Brandon Passmore, Ty McNutt, Daniel Martin, 2017, 2017 IEEE Energy Conversion Congress and Exposition (ECCE).

SiC-MOSFET composite boost converter with 22 kW/L power density for electric vehicle application

Dragan Maksimović, Hua Chen, Hyeokjin Kim, 2017, 2017 IEEE Applied Power Electronics Conference and Exposition (APEC).

A high-frequency, high-efficiency silicon carbide based phase-shifted full-bridge converter as a core component for a high-density on-board vehicle battery charging system

Alexander B. Lostetter, Bret Whitaker, Adam Barkley, 2013, 2013 IEEE ECCE Asia Downunder.

A High-Density, High-Efficiency, Isolated On-Board Vehicle Battery Charger Utilizing Silicon Carbide Power Devices

Jae Seung Lee, Alexander B. Lostetter, Koji Shiozaki, 2014, IEEE Transactions on Power Electronics.

Wide bandgap packaging for next generation power conversion systems

Bret Whitaker, Adam Barkley, Zach Cole, 2013, 2013 4th IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG).

The Design and Development of a 15 kV SiC Half-Bridge Multi-Chip Power Module for Medium Voltage Applications

P. Killeen, Zach Cole, Brandon Passmore, 2014 .

A Disruptive Approach to Electric Vehicle Power Electronics Final Report

Robert W. Erickson, Dragan Maksimovic, Khurram K. Afridi, 2017 .

Verification of High Frequency SiC On-Board Vehicle Battery Charger for PHV

Jae Seung Lee, Alexander B. Lostetter, Koji Shiozaki, 2016 .

A High Performance Power Package for Wide Bandgap Semiconductors Using Novel Wire Bondless Power Interconnections

Chad B. O'Neal, Zach Cole, Brandon Passmore, 2015 .

A High Temperature, Fast Switching SiC Multi-chip Power Module (MCPM) for High Frequency (> 500 kHz) Power Conversion Applications

Bret Whitaker, Adam Barkley, Zach Cole, 2013 .

A 4H Silicon Carbide Gate Buffer for Integrated Power Systems

Alan Mantooth, Laura Marlino, Matt Francis, 2014, IEEE transactions on power electronics.

Ultra-low (1.25mΩ) On-Resistance 900V SiC 62mm Half- Bridge Power Modules Using New 10mΩ SiC MOSFETs

Gangyao Wang, Scott Allen, P. Killeen, 2016 .

The next generation of high voltage (10 kV) silicon carbide power modules

Edward VanBrunt, Brett Hull, Zach Cole, 2016, 2016 IEEE 4th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).