A. Nishizawa

A silicon-on-silicon packaging technology for advanced ULSI chips

Nobuaki Takahashi, T. Kousaka, Naoji Senba, 1993, Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).

Device-deviation tolerant over-1 GHz clock distribution scheme with skew-immune race-free impulse latch circuits

H. Kawamoto, K. Inoue, I. Sakai, 1998, 1998 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, ISSCC. First Edition (Cat. No.98CH36156).

A 0.8 μm CMOS digital signal processor for a video camera

M. Noda, H. Ohtsubo, M. Masuda, 1993, IEEE 1993 International Conference on Consumer Electronics Digest of Technical Papers.

Si-on-Si MCMs As a low cost packaging solution

Nobuaki Takahashi, Naoji Senba, A. Nishizawa, 1994, Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies.

UX6-100 nm generation CMOS integration technology with Cu/low-k interconnect

H. Nambu, T. Tamura, T. Nakata, 2002, 2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303).