M. Brouri

A dc-pulsed capacitively coupled planar Langmuir probe for plasma process diagnostics and monitoring

A. Milenin, W. Boullart, J. Booth, 2012 .

C2H4-Based Plasma-Assisted CD Shrink and Contact Patterning for RRAM Application

N. Jossart, M. Jurczak, J. Lisoni, 2010 .

Advanced metallization scheme for 3×50µm via middle TSV and beyond

G. Beyer, E. Beyne, S. Van Huylenbroeck, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Dielectric liner reliability in via-middle through silicon vias with 3 Micron diameter

G. Beyer, E. Beyne, K. Croes, 2016 .